News
2019.03.12
方案介绍 ●MCU:HK32F030C8T6 ●工作频率72MHz，64KB Flash，8KB SRAM ●三电阻或单电阻采样电流检测 ●支持高电压310V与低电压12V电机驱动 ●适合，扭扭车，滑板车，充电手提电钻， 航模电调,机械转动电机等 ●稳定（svpwm）正弦波FOC算法 ●过流，过温，母线高低电压保护 ●电机工作高效率，超低温与超静
2019.03.12
方案介绍 ●MCU：HK32F030K6U6 ●工作频率50/60Hz ●输出电压：100-240V ●温度：359° ●充电时间：45分钟 ●烟杆：5分钟 ●充电方式：USB ●主要利用MCU的高级定时器的捕捉比较输出及PWM输出实现升压。
2019.03.12
方案介绍 ●MCU：HK32F103RBT6 ●应用的通信接口:USART,I2C,SPI ●供电方式：采用4节5号碱性电池，另加配应供电接口，可用9V叠层电池外接供电 ●主要功能：指纹开启、密码开启、卡片开启、应急钥匙开启
2019.03.12
方案介绍 ●MCU:HK32F103C8T6 ●工作频率：72MHz ●FLASH：128KB ●SRAM：20KB ●通道个数：8 ●频率范围：2401Mhz-2479Mhz ●波段宽度：500Khz ●发射功率：<=70mW ●2.4GHz模式：S-FHSS ●编码方式：FSK ●通道分辨率：1024 ●低压报警：低于4
2019.03.12
MCU：HK32F103CBT6
工作频率 72MHz，128KB FLASH，20KB SRAM
产品工作电压12V±2V；静态电流：≤20mA
CAN 总线控制
门窗电动马达驱动
保留原车遥控器解锁
主要利用MCU的高级定时器的互补PWM功能控制有感电机的正反转。同时利用CAN总线与主控板通信。
The packaging process is relatively complicated, there are about a dozen processes, including grinding and dicing... Grinding is to thin the back of the wafer to meet the needs of packaging; dicing is to use a metal blade to allow the wafer to be Divide them one by one; chip mounting is to use conductive glue to fix the chip and lead frame; bonding is to achieve circuit conduction between the pad of the chip and the frame; plastic packaging is to package the product.
2015.06.03
The packaging process is quite complex, with about a dozen steps, including grinding, scribing, and so on. Grinding is to thin the back of the wafer to meet packaging requirements; scribing is to use a metal blade to allow the wafer to be divided into individual pieces; die attach is to fix the chip to the lead frame using conductive adhesive; bonding is to achieve electrical connection between the chip's pads and the frame; encapsulation is to package the product. The key processes are 'bonding and encapsulation.' Bonding achieves our goal, while encapsulation ensures the quality of bonding and the reliability of the product. Q&A discussion section: 1. Student Chen: Grinding.
2024.04.07
A solution for automotive gear shift switch based on Hangshun chip automotive grade MCU HK32A040C8T3
Throughout the global development of passenger cars, automatic transmission has been widely adopted. Its simple and easy to learn, convenient and intelligent characteristics bring drivers a more comfortable driving experience, and also better adapt to urban traffic.
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2023.10.10
Hangshun chip has obtained the highest ASIL D certification in ISO 26262, and the automotive functional safety management system has been further upgraded
Recently, the international independent third-party testing, inspection, and certification agency SGS has issued the ISO 26262:2018 ASIL D process certification certificate for the highest level of automotive functional safety to Shenzhen Hangshun Chip Technology Research and Development Co., Ltd. (hereinafter referred to as "Hangshun Chip").
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