Development_Shenzhen Hangshun Chip Technology R&D Co., Ltd.

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Development path

2006

Established Shanghai Hangshun Microelectronics

2013

Shenzhen Hangshun Chip Technology R&D Co., Ltd. was formally established

2014

Independent research and development and mass production of LCD display driver chips

2015

Independent research and development of mass production power management chips

2016

Independent research and development and mass production of EEPROM memory chips, Shenzhen National High-tech Enterprise

2017

Formed HK32mcu/soc Wang Xiang R&D team, formally developed 32MCU/SOC, and established Chengdu R&D Center Won the national high-tech enterprise, mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals

2018

Mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals Second Prize of Advanced Manufacturing Enterprise Group of Shenzhen Creation Competition

2019

Mass production of the world's first 32-bit MCU-HK32F030M/0301M family below 1 RMB Mass-produced Hangshun patented M3+FPU high-performance floating-point processing 32-bit MCU-HK32F39A family PER A round of strategic financing, AVIC Lianchuang and Guangzhou are heart-to-heart Check in at Hangshun Chip Headquarters Building in Aviation Technology Innovation and Pioneering Park Won the "Top Ten IC Unicorns in 2018" issued by the World Semiconductor Conference

2020

Mass production of China's first world-class 20nA ultra-low power 32-bit MCU-HK32L0XX family Mass-produced 32-bit MCU-HK32ALG31 family for optical modules to break foreign monopoly Mass production of ultra-low power Bluetooth BLE SOC-HK32W0XX family Mass production of dedicated SOC for 5G optical modules A round of strategic financing, Shenzhen Government Industrial Fund-Addition Fund B round of strategic financing, Chinese Academy of Sciences Guoke Investment B+ round of strategic financing, Goodix Technology The founder leads the senior management team to refine the three cornerstones of corporate culture: mission, vision, and values. The construction of corporate culture and the implementation of the project are in full swing

2021

Launched China's first ARM+RISC-V multi-core heterogeneous SOC-HK32U1009 family Dedicated 32-bit MCU for mass product networking security, built-in FOC hardware acceleration algorithm motor driver, etc. Launched special SOCs such as AI speech recognition and AI image recognition Series C Strategic Financing: Shunwei Capital D round of strategic financing: Shenzhen State-owned Assets Supervision and Administration Commission Shenzhen Investment Control, Fangguang Capital, Kang Chengheng, Meige Intelligence, AVIC Fund D+ round of strategic financing: Haier Huizhi, Shenzhen Venture Capital Won the National Specialized Special New Key "Little Giant" Enterprise Won the top 100 enterprises in Shenzhen industry leaders On October 26th, the airport advertisement of Hangshun chip landed in Shenzhen International Airport

2022

Mass production of more than 300 models of Hangshun HK32MCU from 29 major families To be continued...