Development Path

Development path



2006

Established Shanghai Hangshun Microelectronics


2013

Shenzhen Hangshun Chip Technology R&D Co., Ltd. was formally established


2014

Independent research and development and mass production of LCD display driver chips


2015

Independent research and development of mass production power management chips


2016

Independent research and development and mass production of EEPROM memory chips, Shenzhen National High-tech Enterprise


2017

Formed HK32mcu/soc Wang Xiang R&D team, formally developed 32MCU/SOC, and established Chengdu R&D Center Won the national high-tech enterprise, mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals


2018

Mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals Second Prize of Advanced Manufacturing Enterprise Group of Shenzhen Creation Competition


2019

Mass production of the world's first 32-bit MCU-HK32F030M/0301M family below 1 RMB Mass-produced Hangshun patented M3+FPU high-performance floating-point processing 32-bit MCU-HK32F39A family PER A round of strategic financing, AVIC Lianchuang and Guangzhou are heart-to-heart Check in at Hangshun Chip Headquarters Building in Aviation Technology Innovation and Pioneering Park Won the "Top Ten IC Unicorns in 2018" issued by the World Semiconductor Conference


2020

Mass production of China's first world-class 20nA ultra-low power 32-bit MCU-HK32L0XX family Mass-produced 32-bit MCU-HK32ALG31 family for optical modules to break foreign monopoly Mass production of ultra-low power Bluetooth BLE SOC-HK32W0XX family Mass production of dedicated SOC for 5G optical modules A round of strategic financing, Shenzhen Government Industrial Fund-Addition Fund B round of strategic financing, Chinese Academy of Sciences Guoke Investment B+ round of strategic financing, Goodix Technology The founder leads the senior management team to refine the three cornerstones of corporate...


2021

Launched China's first ARM+RISC-V multi-core heterogeneous SOC-HK32U1009 family Dedicated 32-bit MCU for mass product networking security, built-in FOC hardware acceleration algorithm motor driver, etc. Launched special SOCs such as AI speech recognition and AI image recognition Series C Strategic Financing: Shunwei Capital D round of strategic financing: Shenzhen State-owned Assets Supervision and Administration Commission Shenzhen Investment Control, Fangguang Capital, Kang Chengheng, Meige Intelligence, AVIC Fund D+ round of strategic financing: Haier Huizhi, Shenzhen Venture Capital


2022

Mass production of more than 300 models of Hangshun HK32MCU from 29 major families To be continued...


2023

Obtained 4 major international standard certifications: ISO 26262-ASIL D highest process level, AEC-Q100 Grade 1, 9001 certification, IEC 60730 certification. Added 20+ invention patents: applied for 34 invention patents with 21 granted. 11 major families with 43 new products: product types are widely distributed: general-purpose MCU, dedicated MCU, industrial MCU, automotive MCU, ultra-low power MCU, motor MCU.