Hangshun HK32AUTO39A, the king of cost-effectiveness, preferred SoC for body and cabin areas
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- 2023.12.22
(Summary description) Benefiting from the advancement of electrification, intelligence, and networking in automobiles, the market size of MCU in the automotive body and cabin domains continues to expand. According to statistics, the market size of China's automotive chip MCU reached 3.001 billion US dollars in 2021, a year-on-year increase of 13.59%. It is expected that the market size will reach 4.274 billion US dollars by 2025. In terms of technical requirements, for the cabin domain vehicle specification MCU, due to the involvement of a large amount of data processing and information transmission, it needs to have high computing power and high-speed external communication interfaces. For the vehicle body domain, due to the need to control the working status of various parts of the vehicle body, it also requires a large number of external communication interfaces. The preferred SoC for body and cabin domains is Hangshun HK32AUTO39A The Hangshun Car Class SoC HK32AUTO39A family has advantages such as stability, reliability, excellent performance, and ultra-high cost-effectiveness. It adopts a high-performance ARM Cortex-M3/M0 core and the latest process technology, with a built-in high-speed Cache bus and a maximum of 512K FLASH and 96K SRAM, providing strong support for code processing and computing power. HK32AUTO39A has a built-in CAN controller, which can be connected to the CAN communication bus by combining with an external CAN transceiver to achieve information exchange with other ECUs. At the same time, HK32AUTO39A also has a rich range of peripheral configurations. Strong scalability: HK32AUTO39A-3A uses ARM ® Cortex ®- M3 core, with a good ecological environment; Its abundant peripheral resources can maximize the platform's expansion needs. In addition, the HK32AUTO39A-3A series products include various packaging options such as LQFP64, LQFP48, QFN32, and QFN28. High reliability: HK32AUTO39A-3A has passed strict AEC-Q100 reliability and safety certification, and the product quality meets the Zero Defect supply chain quality management standard ISO/IATF 16949 specification. This year, the Hangshun chip has passed the highest level of automotive functional safety ISO26262 ASIL-D certification. In addition, the product supports ambient temperatures ranging from -40 ℃ to 125 ℃ and has a design lifespan of 15 years. Compared to MCUs with the same performance/resources, HK32AUTO39A-3A has an ultra-high cost performance ratio and a more complete ecological supporting system. At present, HK32AUTO39A-3A has fully blossomed in the body and cabin domains, applied in dozens of important scenarios such as car door and window control, electric window lifting, car taillights, wipers, car air conditioning, electric seats, and entertainment systems. With the improvement of automotive electronics, the technical requirements for automotive MCU are also constantly increasing. Hangshun chip will continue to increase research and development investment, launch more competitive automotive grade MCU products to meet market demand. In the future automotive electronics market, Hangshun chips are expected to continue to play an important role, providing strong support for the development of automotive intelligence, electrification, and networking.
Hangshun HK32AUTO39A, the king of cost-effectiveness, preferred SoC for body and cabin areas
- 2023-12-22
Benefiting from the advancement of electrification, intelligence, and networking in automobiles, the market size of MCU in the automotive body and cabin domains continues to expand. According to statistics, the market size of China's automotive chip MCU reached 3.001 billion US dollars in 2021, a year-on-year increase of 13.59%. It is expected that the market size will reach 4.274 billion US dollars by 2025.
In terms of technical requirements, for the cabin domain vehicle specification MCU, due to the involvement of a large amount of data processing and information transmission, it needs to have high computing power and high-speed external communication interfaces. For the vehicle body domain, due to the need to control the working status of various parts of the vehicle body, it also requires a large number of external communication interfaces.
The preferred SoC for body and cabin domains is Hangshun HK32AUTO39A
The Hangshun Car Class SoC HK32AUTO39A family has advantages such as stability, reliability, excellent performance, and ultra-high cost-effectiveness. It adopts a high-performance ARM Cortex-M3/M0 core and the latest process technology, with a built-in high-speed Cache bus and a maximum of 512K FLASH and 96K SRAM, providing strong support for code processing and computing power.
HK32AUTO39A has a built-in CAN controller, which can be connected to the CAN communication bus by combining with an external CAN transceiver to achieve information exchange with other ECUs. At the same time, HK32AUTO39A also has a rich range of peripheral configurations.
Strong scalability: HK32AUTO39A-3A uses ARM ® Cortex ®- M3 core, with a good ecological environment; Its abundant peripheral resources can maximize the platform's expansion needs. In addition, the HK32AUTO39A-3A series products include various packaging options such as LQFP64, LQFP48, QFN32, and QFN28.
High reliability: HK32AUTO39A-3A has passed strict AEC-Q100 reliability and safety certification, and the product quality meets the Zero Defect supply chain quality management standard ISO/IATF 16949 specification. This year, the Hangshun chip has passed the highest level of automotive functional safety ISO26262 ASIL-D certification. In addition, the product supports ambient temperatures ranging from -40 ℃ to 125 ℃ and has a design lifespan of 15 years.
Compared to MCUs with the same performance/resources, HK32AUTO39A-3A has an ultra-high cost performance ratio and a more complete ecological supporting system. At present, HK32AUTO39A-3A has fully blossomed in the body and cabin domains, applied in dozens of important scenarios such as car door and window control, electric window lifting, car taillights, wipers, car air conditioning, electric seats, and entertainment systems.
With the improvement of automotive electronics, the technical requirements for automotive MCU are also constantly increasing. Hangshun chip will continue to increase research and development investment, launch more competitive automotive grade MCU products to meet market demand. In the future automotive electronics market, Hangshun chips are expected to continue to play an important role, providing strong support for the development of automotive intelligence, electrification, and networking.
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