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2006
2022年01月06日
2006
Established Shanghai Hangshun Microelectronics
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2013
2022年01月06日
2013
Shenzhen Hangshun Chip Technology R&D Co., Ltd. was formally established
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2014
2022年01月06日
2014
Independent research and development and mass production of LCD display driver chips
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2015
2022年01月06日
2015
Independent research and development of mass production power management chips
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2016
2022年01月06日
2016
Independent research and development and mass production of EEPROM memory chips, Shenzhen National High-tech Enterprise
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2017
2022年01月06日
2017
Formed HK32mcu/soc Wang Xiang R&D team, formally developed 32MCU/SOC, and established Chengdu R&D Center Won the national high-tech enterprise, mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals
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2018
2022年01月06日
2018
Mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals Second Prize of Advanced Manufacturing Enterprise Group of Shenzhen Creation Competition
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2019
2022年01月06日
2019
Mass production of the world's first 32-bit MCU-HK32F030M/0301M family below 1 RMB Mass-produced Hangshun patented M3+FPU high-performance floating-point processing 32-bit MCU-HK32F39A family PER A round of strategic financing, AVIC Lianchuang and Guangzhou are heart-to-heart Check in at Hangshun Chip Headquarters Building in Aviation Technology Innovation and Pioneering Park Won the "Top Ten IC Unicorns in 2018" issued by the World Semiconductor Conference
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2020
2022年01月06日
2020
Mass production of China's first world-class 20nA ultra-low power 32-bit MCU-HK32L0XX family Mass-produced 32-bit MCU-HK32ALG31 family for optical modules to break foreign monopoly Mass production of ultra-low power Bluetooth BLE SOC-HK32W0XX family Mass production of dedicated SOC for 5G optical modules A round of strategic financing, Shenzhen Government Industrial Fund-Addition Fund B round of strategic financing, Chinese Academy of Sciences Guoke Investment B+ round of strategic financing, Goodix Technology The founder leads the senior management team to refine the three cornerstones of corporate culture: mission, vision, and values. The construction of corporate culture and the implementation of the project are in full swing
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2021
2022年01月06日
2021
Launched China's first ARM+RISC-V multi-core heterogeneous SOC-HK32U1009 family Dedicated 32-bit MCU for mass product networking security, built-in FOC hardware acceleration algorithm motor driver, etc. Launched special SOCs such as AI speech recognition and AI image recognition Series C Strategic Financing: Shunwei Capital D round of strategic financing: Shenzhen State-owned Assets Supervision and Administration Commission Shenzhen Investment Control, Fangguang Capital, Kang Chengheng, Meige Intelligence, AVIC Fund D+ round of strategic financing: Haier Huizhi, Shenzhen Venture Capital Won the National Specialized Special New Key "Little Giant" Enterprise Won the top 100 enterprises in Shenzhen industry leaders On October 26th, the airport advertisement of Hangshun chip landed in Shenzhen International Airport
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2006
2022.01.06
Established Shanghai Hangshun Microelectronics
2013
2022.01.06
Shenzhen Hangshun Chip Technology R&D Co., Ltd. was formally established
2014
2022.01.06
Independent research and development and mass production of LCD display driver chips
2015
2022.01.06
Independent research and development of mass production power management chips
2016
2022.01.06
Independent research and development and mass production of EEPROM memory chips, Shenzhen National High-tech Enterprise
2017
2022.01.06
Formed HK32mcu/soc Wang Xiang R&D team, formally developed 32MCU/SOC, and established Chengdu R&D Center Won the national high-tech enterprise, mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals
2018
2022.01.06
Mass production China's first forward design PIN TO PIN software fully compatible (M3 core 32-bit MCU-HK32F103 family) Mass production China's first forward design PIN TO PIN software fully compatible (M0 core 32-bit MCU-HK32F030/031 family) Mass production of M3 core HK32F103 family in July Mass production of M0 core HK32F030/031/04A in September Won the runner-up in the Shenzhen Innovation and Entrepreneurship Competition Finals Second Prize of Advanced Manufacturing Enterprise Group of Shenzhen Creation Competition
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